Intel Says New Mexico Leads U.S. Advanced Packaging
Intel published a post on July 29, 2026 about advanced packaging at its Rio Rancho, New Mexico facilities, where Katie Prouty, manager of Intel's Fab 9 advanced packaging facility, says the site is now the leader in the United States for advanced packaging. Advanced packaging means interconnecting multiple specialized chips so they function as a single unit that handles large AI workloads. Intel says packages there are scaling to 8x the industry standard reticle limit today and over 12x by 2028. The site started with 25 employees in 1980 and now has 2,700 employees and 500 suppliers.
Transcript
Intel said today its New Mexico site is now the United States leader in advanced packaging for AI chips.
Advanced packaging connects specialized chips so they work as one unit for AI. Intel's Rio Rancho site grew from twenty five employees in nineteen eighty to twenty seven hundred.
Chiplets are stacked onto a silicon interposer using Foveros. EMIB links chips with embedded silicon bridges. Packages reach eight times the reticle limit, over twelve times by twenty twenty eight.
This is Intel describing its own site and process. The company announced no new product and published no benchmark comparisons against other foundries. It is a capability update.
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Sources
Every claim in this video comes from the top ranking coverage of this topic. The claims and where each one came from:
- Intel's Fab 9 site in New Mexico is the leader in the United States for advanced packaging(Intel official announcement)
- Advanced packaging interconnects multiple specialized chips so they function as a single unit that handles massive AI workloads(Intel official announcement)
- Rio Rancho, New Mexico started with 25 employees in 1980 and has grown to 2,700 employees and 500 suppliers(Intel official announcement)
- Foveros connects chiplets on a silicon interposer into a single high performance system(Intel official announcement)
- EMIB links specialized chips on a package with tiny embedded silicon bridges placed only where they are needed(Intel official announcement)
- Advanced packaging at New Mexico is scaling packages to 8x the industry standard reticle limit today and over 12x by 2028(Intel official announcement)
- The article is an Intel explainer about its own New Mexico site and processes, with no new product launch and no benchmark comparisons against other foundries(Intel official announcement)